GENEVA, June 19 -- BONDTECH AB filed a patent application (EP2025/083022) for “A FILAMENT FEEDING DEVICE FOR USE IN 3D-PRINTING AND METHOD FOR FEEDING A FILAMENT OR CHANGING A FILAMENT”. With publication no. WO/2026/104597, here are the other details related to the patent application:
Kind: Initial Publication without ISR [A2]
IPC: B29C 64/118
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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