GENEVA, Sept. 7 -- AMGEN INC. filed a patent application (US2026/016955) for “4-1BB+FAP BINDING CONSTRUCTS”. With publication no. WO/2026/183388, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C07K 16/40
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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