GENEVA, March 17 -- 3M INNOVATIVE PROPERTIES COMPANY (3M CenterPost Office Box 33427Saint Paul, Minnesota 55133-3427) filed a patent application (PCT/IB2025/058702) for "ELECTRICALLY CONDUCTIVE BONDING TAPE WITH LOW PASSIVE INTERMODULATION" on Aug 28, 2025. With publication no. WO/2026/053074, the details related to the patent application was published on Mar 12, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHOI, Jeongwan (19th FloorDaehan Investment and Securities Building27-3, Yeouido-dong, Yeongdeungpo-guSeoul 150-705), KAPLUN, Marina M. (3M CenterPost Office Box 33427Saint Paul, Minne...