International Patent: 3D FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE USING THROUGH VIAS

GENEVA, Oct. 30 -- HUATIAN TECHNOLOGY (KUNSHAN) ELECTRONICS CO., LTD. filed a patent application (CN2025/120478) for “3D FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE USING THROUGH VIAS”. With publication no. WO/2026/222945, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 20/20

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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