BOISE, Idaho, Aug. 31 -- Boise State University issued the following news release:
With a new National Science Foundation award of nearly $8 million, Boise State University is charged with growing Idaho's strategy and capacity around resilient microelectronics for extreme environments.
The Idaho Established Program to Stimulate Competitive Research (EPSCoR) jurisdiction's E‑RISE project, "Capacity Building for Resilient Microelectronics for Extreme Environments" (XTREME) investigates materials behavior under high temperature, radiation and mechanical stress - conditions central to national needs in energy, defense and aerospace.
This is the State of Idaho's first E-RISE award, and it empowers Boise State to help organize a statewid...