Bhubaneswar, April 18 -- In a major boost to India's semiconductor ambitions, Odisha is set to witness the arrival of one of the world's most advanced chip packaging technologies, with the groundbreaking of the Heterogeneous Integration Packaging Solutions (3D Glass Solutions) unit scheduled for Sunday in Bhubaneswar.
The ceremony will be attended by Chief Minister Mohan Charan Majhi, union Minister for Electronics and IT Ashwini Vaishnaw, and Odisha Electronics and IT Minister Mukesh Mahaling, along with senior government officials, global industry leaders, investors, and members of academia.
The project represents India's first advanced semiconductor packaging unit based on glass substrates and introduces cutting-edge 3D heterogeneous i...