NEW YORK, Aug. 9 -- Three days before Google is expected to take the stage at its Made by Google 2026 event, a comprehensive leak published Sunday by Evan Blass has left almost nothing for the company to announce on August 12. The specification sheet, which Blass distributed through his LeakMail newsletter, covers the full Pixel 11 lineup with component-level detail and US pricing. The picture it draws is of a phone that upgrades where most buyers will notice and cuts in places that will require more explanation.

The central upgrade is the Tensor G6 chip, built on TSMC's 2-nanometer fabrication process. The shift away from Samsung's manufacturing moves the Pixel line past the 3nm node used in the Tensor G5, with implications for heat man...