US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on April 7 for "Chip package structure and method for producing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,821, issued on April 7, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan). "Chip package structure and method for... Read More

US Patent Issued to Aeluma on April 7 for "Stacked focal plane array circuit and method thereof" (California Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,822, issued on April 7, was assigned to Aeluma Inc. (Goleta, Calif.). "Stacked focal plane array circuit and method thereof" was invented b... Read More

US Patent Issued to Powerchip Semiconductor Manufacturing on April 7 for "Image sensor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,823, issued on April 7, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan). "Image sensor structure" was invente... Read More

US Patent Issued to Powerchip Semiconductor Manufacturing on April 7 for "CMOS image sensor with 3D monolithic OSFET and FEMIM" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,824, issued on April 7, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan). "CMOS image sensor with 3D monolithi... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Substrate contact in wafer backside" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,825, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Substrate contact in wafer backside... Read More

US Patent Issued to ZF Friedrichshafen on April 7 for "Image sensor assembly" (Michigan Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,826, issued on April 7, was assigned to ZF Friedrichshafen AG (Friedrichshafen, Germany). "Image sensor assembly" was invented by Thomas E.... Read More

US Patent Issued to Sony Semiconductor Solutions on April 7 for "Solid-state imaging device and manufacturing method therefor" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,827, issued on April 7, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Solid-state imaging device and manufacturing... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,828, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Hyoun-... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Image sensor and electronic system including the same" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,829, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Image sensor and electronic system including... Read More

US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on April 7 for "Solid-state imaging element and manufacturing method thereof" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,830, issued on April 7, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan). "Solid-state imaging element and manufacturin... Read More

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