US Patent Issued to Lam Research on April 7 for "Conformal thermal CVD with controlled film properties and high deposition rate" (Oregon, California, Idaho Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,930, issued on April 7, was assigned to Lam Research Corp. (Fremont, Calif.). "Conformal thermal CVD with controlled film properties and hi... Read More

US Patent Issued to WINBOND ELECTRONICS on April 7 for "Semiconductor structure and method for forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,931, issued on April 7, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan). "Semiconductor structure and method for forming ... Read More

US Patent Issued to Tokyo Electron on April 7 for "Methods and structures for improving etch profile of underlying layers" (New York Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,932, issued on April 7, was assigned to Tokyo Electron Ltd. (Tokyo). "Methods and structures for improving etch profile of underlying layer... Read More

US Patent Issued to Tokyo Electron on April 7 for "Semiconductor devices and methods of manufacturing the same" (New York Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,933, issued on April 7, was assigned to Tokyo Electron Ltd. (Tokyo). "Semiconductor devices and methods of manufacturing the same" was inve... Read More

US Patent Issued to MIKRO MESA TECHNOLOGY on April 7 for "Method of manufacturing structure having multi metal layers" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,934, issued on April 7, was assigned to MIKRO MESA TECHNOLOGY Co. LTD. (Apia, Samoa). "Method of manufacturing structure having multi metal... Read More

US Patent Issued to DISCO on April 7 for "Chip manufacturing method using a laser beam with first and second focused points" (Japanese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,936, issued on April 7, was assigned to DISCO Corp. (Tokyo). "Chip manufacturing method using a laser beam with first and second focused po... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Epitaxial formation with treatment and semiconductor devices resulting therefrom" (Taiwanese, American Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,937, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Epitaxial formation with treatment ... Read More

US Patent Issued to SILTRONIC on April 7 for "Device for drying semiconductor substrates" (German Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,938, issued on April 7, was assigned to SILTRONIC AG (Munich). "Device for drying semiconductor substrates" was invented by Sebastian Geiss... Read More

US Patent Issued to SCREEN Holdings on April 7 for "Substrate bonding device, calculation device, substrate bonding method, and calculation method" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,939, issued on April 7, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate bonding device, calculation device, substrate b... Read More

US Patent Issued to SCREEN Holdings on April 7 for "Method for measuring temperature" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,940, issued on April 7, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Method for measuring temperature" was invented by Yukio O... Read More

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