Japan, May 13 -- WONDERLAND SWITZERLAND AG has got intellectual property rights for 'SHOULDER BELT ASSEMBLY AND BABY CARRIAGE.' Other related details are as follows: Application Number: JP,2025-07242... Read More
Japan, May 13 -- VICORE PHARMA AB has got intellectual property rights for 'NEW DELAYED RELEASE COMPOSITION FOR PERORAL ADMINISTRATION.' Other related details are as follows: Application Number: JP,2... Read More
Japan, May 13 -- TOYOTA MOTOR CORP has got intellectual property rights for 'VEHICLE DISPLAY CONTROL DEVICE, VEHICLE DISPLAY DEVICE, VEHICLE, VEHICLE DISPLAY CONTROL METHOD, AND VEHICLE DISPLAY CONTRO... Read More
Japan, May 13 -- SUMITOMO ELECTRIC IND LTD,SUMITOMO WIRING SYST LTD,AUTO NETWORK GIJUTSU KENKYUSHO:KK has got intellectual property rights for 'FLOOR WIRING MODULE AND FLOOR WIRING MODULE MANUFACTURIN... Read More
Japan, May 13 -- NEC PLATFORMS LTD has got intellectual property rights for 'COMMUNICATION CONTROL DEVICE, COMMUNICATION SYSTEM, COMMUNICATION CONTROL METHOD, AND PROGRAM.' Other related details are a... Read More
Japan, May 13 -- MITSUBISHI CHEMICAL CORP has got intellectual property rights for 'MANUFACTURING METHOD OF RESIN COMPOSITION LAYER, RESIN COMPOSITION LAYER OBTAINED BY THE MANUFACTURING METHOD, AND C... Read More
Japan, May 13 -- SEMICONDUCTOR ENERGY LAB CO LTD has got intellectual property rights for 'DISPLAY DEVICE.' Other related details are as follows: Application Number: JP,2025-062074 Category (FI): G0... Read More
Japan, May 13 -- TOKYO ELECTRON LTD has got intellectual property rights for 'SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD.' Other related details are as follows: Application Number: J... Read More
Japan, May 13 -- DENSO CORP has got intellectual property rights for 'SEMICONDUCTOR MODULE.' Other related details are as follows: Application Number: JP,2025-061460 Category (FI): H01L23/36@A,H01L2... Read More
Japan, May 13 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE.' Other related details a... Read More