US Patent Issued to EngeniusMicro on April 21 for "Systems and methods for additive connections in integrated circuits" (Alabama Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,844, issued on April 21, was assigned to EngeniusMicro LLC (Huntsville, Ala.). "Systems and methods for additive connections in integrated... Read More

US Patent Issued to Tokyo Electron on April 21 for "Method for forming semiconductor packages using dielectric alignment marks and laser liftoff process" (New York Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,845, issued on April 21, was assigned to Tokyo Electron Ltd. (Tokyo). "Method for forming semiconductor packages using dielectric alignmen... Read More

US Patent Issued to CR RUNAN TECHNOLOGIES (CHONGQING) on April 21 for "Semiconductor encapsulation method and semiconductor encapsulation structure" (Chinese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,846, issued on April 21, was assigned to CR RUNAN TECHNOLOGIES (CHONGQING) Co. LTD. (Chongqing, China). "Semiconductor encapsulation metho... Read More

US Patent Issued to SKY CHIP INTERCONNECTION TECHNOLOGY on April 21 for "Packaging method and package member" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,847, issued on April 21, was assigned to SKY CHIP INTERCONNECTION TECHNOLOGY Co. LTD. (Shenzhen, China). "Packaging method and package mem... Read More

US Patent Issued to Murata Manufacturing on April 21 for "Electronic component and method for forming resin layer on electronic component" (Japanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,848, issued on April 21, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan). "Electronic component and method for forming resin ... Read More

US Patent Issued to PANJIT INTERNATIONAL on April 21 for "Semiconductor packaging structure" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,849, issued on April 21, was assigned to PANJIT INTERNATIONAL INC. (Kaohsiung City, Taiwan). "Semiconductor packaging structure" was inven... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Semiconductor package and method for manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,850, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method for manuf... Read More

US Patent Issued to STATS ChipPAC on April 21 for "Semiconductor device and method of making a dual-side molded system-in-package with fine-pitched interconnects" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,851, issued on April 21, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor device and method of making a dual-side molde... Read More

US Patent Issued to Huawei Technologies'Co., 'Ltd.' on April 21 for "Switching power module and communications device" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,852, issued on April 21, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Switching power module and communications devic... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 21 for "Semiconductor device structure with bonding pad and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,854, issued on April 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device structur... Read More

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