US Patent Issued to SEIKO EPSON on April 14 for "Method for manufacturing vibration element" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,627, issued on April 14, was assigned to SEIKO EPSON Corp. (Japan). "Method for manufacturing vibration element" was invented by Takuro Ko... Read More

US Patent Issued to ENKRIS SEMICONDUCTOR on April 14 for "Semiconductor structure and method for preparing semiconductor structure, film bulk acoustic resonator and method for preparing film bulk acoustic resonator" (Chinese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,628, issued on April 14, was assigned to ENKRIS SEMICONDUCTOR INC. (Suzhou, China). "Semiconductor structure and method for preparing semi... Read More

US Patent Issued to Soitec on April 14 for "Composite structure and associated production method" (French Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,629, issued on April 14, was assigned to Soitec (Bernin, France). "Composite structure and associated production method" was invented by P... Read More

US Patent Issued to Advanced Energy Industries on April 14 for "Match network with switchable variable capacitance" (Colorado Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,630, issued on April 14, was assigned to Advanced Energy Industries Inc. (Denver). "Match network with switchable variable capacitance" wa... Read More

US Patent Issued to Knowles Cazenovia on April 14 for "Varactor-tunable radio frequency resonant circuits and components" (New York Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,631, issued on April 14, was assigned to Knowles Cazenovia Inc. (Cazenovia, N.Y.). "Varactor-tunable radio frequency resonant circuits and... Read More

US Patent Issued to RF360 Singapore on April 14 for "Bulk acoustic wave devices having electrodes with acoustic impedance gradients to improve coupling efficiency and related fabrication methods" (German, Finnish Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,632, issued on April 14, was assigned to RF360 Singapore Pte. Ltd. (Republic Plaza, Singapore). "Bulk acoustic wave devices having electro... Read More

US Patent Issued to Skyworks Solutions on April 14 for "Acoustic wave devices with improved heat management" (North Carolina, California Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,634, issued on April 14, was assigned to Skyworks Solutions Inc. (Irvine, Calif.). "Acoustic wave devices with improved heat management" w... Read More

US Patent Issued to Sanan Japan Technology on April 14 for "Acoustic wave device and module" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,635, issued on April 14, was assigned to Sanan Japan Technology Corp. (Tokyo). "Acoustic wave device and module" was invented by Yuki Koto... Read More

US Patent Issued to Skyworks Solutions on April 14 for "Packaged acoustic wave devices with multi-layer piezoelectric substrate" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,636, issued on April 14, was assigned to Skyworks Solutions Inc. (Irvine, Calif.). "Packaged acoustic wave devices with multi-layer piezoe... Read More

US Patent Issued to Daishinku on April 14 for "Piezoelectric vibration device and manufacturing method therefor" (Japanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,637, issued on April 14, was assigned to Daishinku Corp. (Kakogawa, Japan). "Piezoelectric vibration device and manufacturing method there... Read More

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