US Patent Issued to TOYO KOHAN on April 14 for "Copper clad laminate and method for producing the same" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,417, issued on April 14, was assigned to TOYO KOHAN Co. LTD. (Tokyo). "Copper clad laminate and method for producing the same" was invente... Read More

US Patent Issued to TOYO KOHAN on April 14 for "Copper clad laminate and method for producing the same" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,417, issued on April 14, was assigned to TOYO KOHAN Co. LTD. (Tokyo). "Copper clad laminate and method for producing the same" was invente... Read More

US Patent Issued to HS ELEKTRONIK SYSTEME on April 14 for "Printed circuit board assembly for an aircraft solid state power controller" (German Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,418, issued on April 14, was assigned to HS ELEKTRONIK SYSTEME GMBH (Nordlingen, Germany). "Printed circuit board assembly for an aircraft... Read More

US Patent Issued to Honeywell International on April 14 for "Barrier layer for an electrical device" (North Carolina Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,419, issued on April 14, was assigned to Honeywell International Inc. (Charlotte, N.C.). "Barrier layer for an electrical device" was inve... Read More

US Patent Issued to Honeywell International on April 14 for "Barrier layer for an electrical device" (North Carolina Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,419, issued on April 14, was assigned to Honeywell International Inc. (Charlotte, N.C.). "Barrier layer for an electrical device" was inve... Read More

US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on April 14 for "Sensor package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,420, issued on April 14, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan). "Sensor package structure and manufa... Read More

US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on April 14 for "Sensor package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,420, issued on April 14, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan). "Sensor package structure and manufa... Read More

US Patent Issued to YAZAKI, TOYOTA JIDOSHA on April 14 for "Electronic component module" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,421, issued on April 14, was assigned to YAZAKI Corp. (Tokyo) and TOYOTA JIDOSHA K.K. (Toyota, Japan). "Electronic component module" was i... Read More

US Patent Issued to YAZAKI, TOYOTA JIDOSHA on April 14 for "Electronic component module" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,421, issued on April 14, was assigned to YAZAKI Corp. (Tokyo) and TOYOTA JIDOSHA K.K. (Toyota, Japan). "Electronic component module" was i... Read More

US Patent Issued to FLYTECH TECHNOLOGY on April 14 for "Separable control box module" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,422, issued on April 14, was assigned to FLYTECH TECHNOLOGY Co. LTD. (Taipei City, Taiwan). "Separable control box module" was invented by... Read More

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