US Patent Issued on April 14 for "Securely linked near field communication device" (California Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,407, issued on April 14. "Securely linked near field communication device" was invented by Timofey Makhlay (Marina Del Ray, Calif.). Acco... Read More

US Patent Issued on April 14 for "Securely linked near field communication device" (California Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,407, issued on April 14. "Securely linked near field communication device" was invented by Timofey Makhlay (Marina Del Ray, Calif.). Acco... Read More

US Patent Issued to DELTA ELECTRONICS on April 14 for "Circuit board module and electronic device with the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,408, issued on April 14, was assigned to DELTA ELECTRONICS INC. (Taoyuan City, Taiwan). "Circuit board module and electronic device with t... Read More

US Patent Issued to DELTA ELECTRONICS on April 14 for "Circuit board module and electronic device with the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,408, issued on April 14, was assigned to DELTA ELECTRONICS INC. (Taoyuan City, Taiwan). "Circuit board module and electronic device with t... Read More

US Patent Issued to SAMSUNG ELECTRO-MECHANICS on April 14 for "Photonic integrated circuit embedded substrate and photonic integrated circuit package" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,409, issued on April 14, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Photonic integrated circuit embedded... Read More

US Patent Issued to SAMSUNG ELECTRO-MECHANICS on April 14 for "Photonic integrated circuit embedded substrate and photonic integrated circuit package" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,409, issued on April 14, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Photonic integrated circuit embedded... Read More

US Patent Issued to TDK on April 14 for "Electronic component" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,410, issued on April 14, was assigned to TDK Corp. (Tokyo). "Electronic component" was invented by Atsuhiro Tsuyoshi (Tokyo), Takashi Ohts... Read More

US Patent Issued to TDK on April 14 for "Electronic component" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,410, issued on April 14, was assigned to TDK Corp. (Tokyo). "Electronic component" was invented by Atsuhiro Tsuyoshi (Tokyo), Takashi Ohts... Read More

US Patent Issued to Robert Bosch on April 14 for "Flexible printed circuit board, in particular for connecting electrical and/or electronic components" (German Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,411, issued on April 14, was assigned to Robert Bosch GmbH (Stuttgart, Germany). "Flexible printed circuit board, in particular for connec... Read More

US Patent Issued to Robert Bosch on April 14 for "Flexible printed circuit board, in particular for connecting electrical and/or electronic components" (German Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,411, issued on April 14, was assigned to Robert Bosch GmbH (Stuttgart, Germany). "Flexible printed circuit board, in particular for connec... Read More

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