US Patent Issued to SAMSUNG ELECTRO-MECHANICS on April 14 for "Photonic integrated circuit embedded substrate and photonic integrated circuit package" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,409, issued on April 14, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Photonic integrated circuit embedded substrate and photonic integrated circuit package" was invented by Kwang Yun Kim (Suwon-si, South Korea), Kyung Sang Lim (Suwon-si, South Korea), Seung Eun Lee (Suwon-si, South Korea) and Yong Hoon Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A photonic integrated circuit embedded substrate may include: an embedded insulating layer on which a photonic integrated circuit is disposed, and at least one first insulating layer stacked on one surface of the embedded insulating layer. The a...