India, May 29 -- Union Minister for Electronics and Information Technology Ashwini Vaishnaw welcomed the agreement, stating that the partnership would help advance India's semiconductor manufacturing capabilities.

In a post on X, the minister congratulated the Odisha government, Intel and 3DGS for signing the pact aimed at bringing substrate manufacturing technology to the country.

The agreement builds on Odisha's growing semiconductor ambitions, which gained momentum earlier this year with the launch of major chip infrastructure projects.

In April, the foundation stone was laid for India's first advanced 3D chip packaging facility at Info Valley, Bhubaneswar, under the Heterogeneous Integration Packaging Solutions project promoted by...