India, Oct. 12 -- Monday, NVIDIA Corp. (NVDA) and Cisco Systems, Inc. (CSCO) shared their plans for Ultra-Dense Small Form Factor Pluggable, a new high-density 400Gb/s-per-lane optical module designed to equip the hardware ecosystem for the next generation of AI factories using pluggable transceivers.
These plans are expected to help customers embrace next-generation optical technology and meet the performance demand of AI workloads without overhauling their data center infrastructure.
For this, NVIDIA and Cisco are collaborating with TE Connectivity and Amphenol to build USFP cages, connectors and modules, with additional partners expected to join.
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