Japan, March 31 -- Toshiba Corporation announced that it has signed a memorandum of understanding (MoU) to start discussions regarding a business integration of the semiconductor business of its subsidiary, Toshiba Electronic Devices & Storage Corporation (hereinafter "TDSC"), the semiconductor business of ROHM Co., Ltd., and the power device business of Mitsubishi Electric Corporation. The MoU was signed with Japan Industrial Partners, Inc. (hereinafter "JIP"), TBJ Holdings Corporation (hereinafter "TBJH"), ROHM, and Mitsubishi Electric.Amid increasingly intense international competition in the semiconductor industry, TDSC and ROHM have for some time been examining collaboration in the power devices business.As part of these efforts, in De...