Suzhou Winmax Technology Corp. secures contract for Procurement of 0705-264506026053 ICB for Wafer Deep Hole Cleaning Machine of Shanghai Xinyuan Innovation Center(1)

China, May 15 -- China based Suzhou Winmax Technology Corp. has secured contract from Shanghai Xinyuan Innovation Center for Procurement of 0705-264506026053 ICB for Wafer Deep Hole Cleaning Machine of Shanghai Xinyuan Innovation Center(1). The value of the contract is not disclosed.

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