United States, Oct. 13 -- NVIDIA and Cisco announced plans for Ultra-Dense Small Form Factor Pluggable (USFP), a new high-density 400Gb/s-per-lane optical module designed to equip the hardware ecosystem for the next generation of AI factories using pluggable transceivers.As AI models grow and inference demand expands, AI factories must connect more computing systems while managing network complexity, power and costs. Moving more data per watt and per switch helps operators make better use of their infrastructure investments.Scaling AI factories requires more bandwidth per connection and more connections per switch. When a switch reaches its capacity, further network expansion can require additional switch layers and optical links, increasin...