KINGSEMI Chiplet Co., Ltd. secures contract for Procurement of 0705-264610026199/27 ICB for Temporary bonding equipment of Shanghai Xinyuan Innovation Center(1)

Posted On: 2026-07-28

China, July 28 -- China based KINGSEMI Chiplet Co., Ltd. has secured contract from Shanghai Xinyuan Innovation Center for Procurement of 0705-264610026199/27 ICB for Temporary bonding equipment of Shanghai Xinyuan Innovation Center(1) . The value of the contract is not disclosed .

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इस लेख के रीप्रिंट को खरीदने या इस प्रकाशन का पूरा फ़ीड प्राप्त करने के लिए, कृपया हमे संपर्क करें.

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KINGSEMI Chiplet Co., Ltd. secures contract for Procurement of 0705-264610026199/27 ICB for Temporary bonding equipment of Shanghai Xinyuan Innovation Center(1)