Bhubaneswar, May 30 -- In a major boost to India's semiconductor ambitions, the Government of Odisha, Intel Corporation, and 3DGS Inc. (USA) have signed a landmark Memorandum of Understanding (MoU) to establish an Advanced Packaging Glass Core Substrate Manufacturing Facility in the Bhubaneswar-Khordha region of Odisha.

The agreement was witnessed by Union Minister of Electronics & IT, Ashwini Vaishnaw, and Odisha Chief Minister, Mohan Charan Majhi, along with Intel CEO Lip-Bu Tan and other dignitaries.

The facility, described as one of the largest high-technology manufacturing investments in India, aims to produce advanced packaging glass core substrates, high-density interconnect substrates, and related semiconductor technologies. Int...