Bhubaneswar, April 19 -- In a major boost to India's semiconductor ambitions, the foundation stone for the country's first advanced 3D chip packaging unit was laid on Wednesday at Info Valley in Bhubaneswar, Odisha. The project marks a significant milestone in strengthening the nation's domestic semiconductor ecosystem and aligns with the broader vision of Atmanirbhar Bharat in high-end electronics manufacturing.

Addressing the gathering, CM Mohan Majhi described the initiative as a historic achievement for both Odisha and the country. He highlighted that, for the first time in India, an advanced 3D Glass Solutions semiconductor project is being established, placing Odisha at the forefront of next-generation technology infrastructure....