New Delhi, Oct. 22 -- Samsung Electro-Mechanics (SEM) has announced a strategic partnership with NVIDIA to provide high-end artificial intelligence (AI) processors and high-speed networking switches using advanced ABF package substrates. The South Korean firm has said it will roll out production starting in 2026 and increase output to address the rising demand for AI computing equipment.

Separately, South Korean outlets Chosun and TheElec report that Samsung Foundry is preparing to raise production of its next-generation Exynos 2700 chip on its second-generation 2nm process. Together, the two developments could strengthen the Samsung group's position in AI and semiconductors.

Under the deal, SEM will supply ABF package substrates for NV...