Bhubaneswar, April 20 -- In a major push to Indias semiconductor ambitions, the foundation stone for the countrys first advanced 3D chip packaging unit has been laid at Info Valley in Bhubaneswar, marking a significant step towards strengthening the domestic semiconductor ecosystem.
The project, promoted by 3D Glass Solutions, involves an investment of nearly Rs 2,000 crore and will establish a state-of-the-art advanced packaging and embedded glass substrate facility. It is expected to support high-growth sectors such as artificial intelligence, high-performance computing, defence electronics and telecommunications.
Chief Minister Mohan Charan Majhi described the initiative as a historic milestone, stating that Odisha is emerging as a k...