Japan, Sept. 3 -- 北京芯馳半導体科技股▲ふん▼有限公司 holds the trademark for '芯馳.' Other related details are as follows:
Application Number: Reg.No.7076381
Class: 09
Status: LIVE-REGISTRATION-Published for Opposition
Filing Date: Jan. 9
Registration Date: Aug. 24
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/c1801/TR/JP-2026-001733/40/en
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