Japan, May 21 -- APPLIED MATERIALS INC has got intellectual property rights for 'WAFER PROCESSING TOOL AND METHOD THEREOF.' Other related details are as follows:

Application Number: JP,2024-223718

Category (FI): H01L21/304,622@Z,H10P52/00@P,H10P72/30@A,H01L21/68@A,H10P52/40,H01L21/304,622@L,H10P52/00@Z,H10P52/00@T

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Dec. 19, 2024

Publication Date: April 10, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....