Japan, Aug. 6 -- DISCO CORP has got intellectual property rights for 'WAFER PROCESSING METHOD.' Other related details are as follows:

Application Number: JP,2022-150230

Category (FI): H10P58/00@L,B23K26/53,H01L21/78@Q,H01L21/78@L,H01L21/78@B,H10P58/00@B,H10P58/00@Q

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Sept. 21, 2022

Publication Date: April 2, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....