Japan, July 27 -- DISCO CORP has got intellectual property rights for 'WAFER GRINDING METHOD AND GRINDING APPARATUS.' Other related details are as follows:

Application Number: JP,2021-171540

Category (FI): H01L21/304,631,H10P52/00@C,H01L21/68@P,H10P72/78

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Oct. 20, 2021

Publication Date: May 2, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....