Japan, June 10 -- TOSHIBA CORP has got intellectual property rights for 'WAFER AND SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2024-018935
Category (FI): H01L29/80@H,H10D30/47,201
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Feb. 9, 2024
Publication Date: Aug. 22, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....