Japan, July 9 -- TOSHIBA CORP has got intellectual property rights for 'WAFER AND METHOD FOR MANUFACTURING THE SAME.' Other related details are as follows:
Application Number: JP,2023-147110
Category (FI): C30B29/36@A,H10P72/70,H01L21/68@N,H01L21/304,621,H10P52/00@Z
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Sept. 11, 2023
Publication Date: March 24, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....