Japan, May 13 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE.' Other related details are as follows:
Application Number: JP,2025-070898
Category (FI): C08K3/013,H10W74/47,C08G59/18,C08K5/3492,C08K5/5465,H01L23/30@R,C08L63/00@C
Stage: Grant (IP right granted following substantive examination.)
Filing Date: April 22, 2025
Publication Date: July 3, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....