Japan, June 10 -- SEIKO EPSON CORP has got intellectual property rights for 'THREE-DIMENSIONAL MOLDING SYSTEM AND METHOD FOR MANUFACTURING THREE-DIMENSIONAL MOLDED OBJECT.' Other related details are as follows:

Application Number: JP,2022-135133

Category (FI): B29C64/245,B29C64/106,B29C64/295,B29C64/209,B29C64/35,B29C64/241,B33Y10/00,B33Y30/00,B33Y40/00

Stage: Grant (IP right document published.)

Filing Date: Aug. 26, 2022

Publication Date: March 7, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....