Japan, July 27 -- SEIKO EPSON CORP has got intellectual property rights for 'THREE-DIMENSIONAL MOLDING DEVICE.' Other related details are as follows:
Application Number: JP,2022-023729
Category (FI): B29C64/364,B29C64/118,B29C64/25,B33Y40/20,B28B1/30,B22F10/16,B29C64/295,B33Y30/00
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Feb. 18, 2022
Publication Date: Aug. 30, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....