Japan, March 5 -- DIC CORP has got intellectual property rights for 'THERMOSETTING RESIN COMPOSITION, BULK MOLDING COMPOUND AND MOLDED ARTICLE THEREOF.' Other related details are as follows:
Application Number: JP,2022-105814
Category (FI): C08F2/44@A,C08F2/44@C,C08F212/08,C08F283/01
Stage: PROBLEM TO BE SOLVED: To provide: a thermosetting resin composition that offers excellent mixability and storage stability, exhibits low shrinkage during molding, and yields a molded article with superior flame retardancy and thermal conductivity as well as a low specific gravity; a bulk molding compound; and a molded article thereof.SOLUTION: A thermosetting resin composition contains an unsaturated polyester resin (A), a shrinkage reducer (B), alumi...