Japan, June 25 -- CHIPBOND TECHNOLOGY CORP has got intellectual property rights for 'TEST PAD.' Other related details are as follows:
Application Number: JP,2024-208084
Category (FI): H10D89/10@P,H01L21/66@E,H10P74/00@E
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Nov. 29, 2024
Publication Date: July 9, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....