Japan, March 24 -- TOKYO SEIMITSU CO LTD has got intellectual property rights for 'SURFACE MODIFICATION METHOD FOR SILICON WAFER.' Other related details are as follows:
Application Number: JP,2024-187092
Category (FI): C30B29/06@B,C30B33/04,H01L21/304,622@Y,H10P52/00@Y,H10P54/20,201
Stage: Grant (IP right document published.)
Filing Date: Oct. 24, 2024
Publication Date: Jan. 22, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....