Japan, June 22 -- TOKYO ELECTRON LTD has got intellectual property rights for 'SUBSTRATE PROCESSING METHOD AND WAFER PROCESSING SYSTEM.' Other related details are as follows:
Application Number: JP,2022-202357
Category (FI): H01L21/304,601@B,H01L21/02@B,B23K26/53,H10P54/20,201,H10P74/20@P,H10P95/60@B,H10P52/00@R,H10P10/00@A,H01L21/66@P
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 19, 2022
Publication Date: July 1, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....