Japan Intellectual Property Rights: SUBSTRATE BODY AND METHOD OF MANUFACTURING THE SAME

Japan, Sept. 30 -- CHIPBOND TECHNOLOGY CORP has got intellectual property rights for 'SUBSTRATE BODY AND METHOD OF MANUFACTURING THE SAME.' Other related details are as follows:

Application Number: JP,2025-057656

Category (FI): H10W72/20,101@G,H05K3/32@Z,H10W72/20,103@G,H10W72/20,103@A,H10W72/20,101@A,H05K3/32,H01L21/92,602@K,H01L21/92,602@D,H01L21/92,604@B,H01L21/92,604@S

Stage: Grant (IP right granted following substantive examination.)

Filing Date: March 31, 2025

Publication Date: Jan. 22

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....