Japan, July 1 -- BANDO KIKO CO LTD has got intellectual property rights for 'SPLITTING AND CUTTING SYSTEM AND SPLITTING AND CUTTING METHOD.' Other related details are as follows:

Application Number: JP,2022-064199

Category (FI): B28D7/04,B28D5/00@Z,B26F3/00@A,C03B33/027,C03B33/033

Stage: Grant (IP right granted following substantive examination.)

Filing Date: April 8, 2022

Publication Date: Oct. 20, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....