Japan, Aug. 14 -- TAMURA SEISAKUSHO CO LTD has got intellectual property rights for 'SOLDER ALLOY, SOLDER PASTE, PRINTED CIRCUIT BOARD, AND ELECTRONIC CONTROL DEVICE.' Other related details are as follows:
Application Number: JP,2022-171040
Category (FI): H05K3/346,B23K35/363@E,B23K35/26,310@A,H05K3/341,C22C13/02,H05K3/34,512@C,C22C13/00,B23K35/22,310@A
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Oct. 25, 2022
Publication Date: May 10, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....