Japan Intellectual Property Rights: SINGLE-SIDED POLISHING DEVICE OF WORK-PIECE, SINGLE-SIDED POLISHING METHOD OF WORK-PIECE, AND MANUFACTURING METHOD OF SILICON WAFER

Japan, July 1 -- SUMCO CORP has got intellectual property rights for 'SINGLE-SIDED POLISHING DEVICE OF WORK-PIECE, SINGLE-SIDED POLISHING METHOD OF WORK-PIECE, AND MANUFACTURING METHOD OF SILICON WAFER.' Other related details are as follows:

Application Number: JP,2022-189485

Category (FI): H01L21/304,622@F,B24B37/12@D,B24B55/06,B24B37/00@K,B24B53/017@Z,B24B37/005@Z,H01L21/304,621@B,H10P52/00@A,H10P52/00@D

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Nov. 28, 2022

Publication Date: June 7, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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