Japan Intellectual Property Rights: SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE MANUFACTURING METHOD (SOURCE/DRAIN CONTACT POSITIONING UNDER POWER RAIL)

Japan, July 27 -- INTERNATIONAL BUSINESS MASCHINES CORPORATION has got intellectual property rights for 'SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE MANUFACTURING METHOD (SOURCE/DRAIN CONTACT POSITIONING UNDER POWER RAIL).' Other related details are as follows:

Application Number: JP,2022-151893

Category (FI): H01L29/78,301@P,H01L27/092@F,H10D30/62,H10D84/85@F,H10D30/01,101@P

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Sept. 22, 2022

Publication Date: April 11, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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