Japan, March 6 -- KYOCERA CORP has got intellectual property rights for 'SEMICONDUCTOR SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE.' Other related details are as follows:

Application Number: JP,2022-038612

Category (FI): C08K5/524,H10W74/47,C08L63/00@B,C08L63/00@C,C08L63/00@Z,C08K3/013,C08L61/06,C08K3/22,C08K3/04,C08G59/62,H01L23/30@R

Stage: Grant (IP right granted following substantive examination.)

Filing Date: March 11, 2022

Publication Date: Sept. 22, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....