Japan, July 31 -- HUABANG ELECTRONIC CO LTD has got intellectual property rights for 'SEMICONDUCTOR LAMINATED WAFER.' Other related details are as follows:
Application Number: JP,2025-070113
Category (FI): G11C29/00,402,G11C29/00,412,G11C29/00,468,G11C29/02,110,G11C5/04,200,H10B99/00,495
Stage: Grant (IP right granted following substantive examination.)
Filing Date: April 22, 2025
Publication Date: Nov. 28, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....