Japan, Oct. 21 -- GE AVIATION SYSTEMS LLC has got intellectual property rights for 'SEMICONDUCTOR DEVICE PACKAGE AND FORMING METHOD.' Other related details are as follows:

Application Number: JP,2025-067676

Category (FI): H10W90/00,800,H10W70/62,500,H10W70/00@B,H01L23/12@B,H01L23/12,501@P,H01L25/04@C

Stage: Grant (IP right granted following substantive examination.)

Filing Date: April 16, 2025

Publication Date: Aug. 5, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....