Japan, April 22 -- GE AVIATION SYSTEMS LLC has got intellectual property rights for 'SEMICONDUCTOR DEVICE PACKAGE AND FORMING METHOD.' Other related details are as follows:
Application Number: JP,2023-008840
Category (FI): H01L25/04@C,H10W90/00,800
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 24, 2023
Publication Date: Aug. 4, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....