Japan Intellectual Property Rights: SEMICONDUCTOR DEVICE ARRANGEMENT STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Japan, Sept. 16 -- SHOGEN KODEN KOFUN YUGENKOSHI has got intellectual property rights for 'SEMICONDUCTOR DEVICE ARRANGEMENT STRUCTURE AND METHOD OF MANUFACTURING THE SAME.' Other related details are as follows:

Application Number: JP,2024-090468

Category (FI): H10H20/01@A,H01L33/62,H10H20/857,H10H29/03,H10H29/01,H10H29/02

Stage: PROBLEM TO BE SOLVED: To provide a semiconductor device arrangement structure.SOLUTION: This structure includes: a substrate; an adhesive structure; and a first semiconductor device. The substrate includes an upper front surface, and the adhesive structure is positioned on the upper front surface and includes a first concave region. The first semiconductor device contains a lower front surface facing towards an a...