Japan Intellectual Property Rights: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Japan, Sept. 18 -- ASAHI KASEI CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF.' Other related details are as follows:

Application Number: JP,2022-164694

Category (FI): H10W74/15,H10W70/69,H01L23/30@D,H01L23/12,501@P,H10W70/62,500

Stage: PROBLEM TO BE SOLVED: To provide a semiconductor device capable of protecting a semiconductor chip and improving adhesion between a protective layer side and an insulating layer side in a rewiring layer.SOLUTION: A semiconductor device includes a semiconductor chip 2, a sealing material 3 in contact with the semiconductor chip 2, a rewiring layer 4 having an area larger than that of the semiconductor chip 2 in plan view, and a protective layer 8 for pr...