Japan, June 10 -- MIRISE TECHNOLOGIES CORP,TOYOTA MOTOR CORP,DENSO CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF.' Other related details are as follows:
Application Number: JP,2022-210136
Category (FI): H01L29/06,301@V,H10D30/66,102@G,H10D62/10,101@V,H10D62/10,101@M,H10D30/66,201@C,H10D30/66,103@S,H10D30/66,102@B,H10D30/66,101@T,H10D30/66,101@F,H10D30/66,101@B,H10D30/01,301@G,H01L29/78,653@C,H01L29/78,652@B,H01L29/78,658@G,H01L29/78,658@F,H01L29/78,652@T,H10D30/01,301@F,H01L29/06,301@M,H01L29/78,652@K,H01L29/78,652@F,H01L29/78,652@S
Stage: Grant (IP right document published.)
Filing Date: Dec. 27, 2022
Publication Date: July 9, 2024
The original document can be viewed at: https://...